International Journal of Advances in Science, Engineering and Technology(IJASEAT)
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current issues
Volume-7,Issue-4  ( Oct, 2019 )
Statistics report
Feb
Submitted Papers : 80
Accepted Papers : 10
Rejected Papers : 70
Acc. Perc : 12%
  Journal Paper

Paper Title
Effect of Bias Voltage on Heat Dissipation Application of Diamond-like Carbon Films

Abstract
In this paper, aiming at development in heat dissipation layer for commercial electronics products, hydrogen-free diamond-like carbon (DLC) films have been deposited on copper foil at room temperature using unbalanced magnetron radio frequency sputtering technique with a novel nanodiamond target. Moreover, DC bias for Cu foil was optimized to improve the characteristics of the as-prepared DLC film. The effects of the applied substrate bias on surface morphology and microstructure of the DLC films were systematically investigated by scanning probe microscopy, Raman spectroscopy, X-ray photoemission spectroscopy, and atomic forced microscopy. The results shown that the films deposited under DC bias of -45 V possessed uniform surface morphology, high sp3 content and low surface roughness. A large area of DLC/Cu foil was fabricated for thermal diffusion test with heat source power of 3 W and working temperature of 50oC. The data reveals that the thermal diffusivity of the Cu foil heat sink were improve by 22 % by using DLC films. The aforementioned results indeed open up an avenue for the uses of DLC materials in heat dissipation applications in advance electronics products. Keywords - Diamond-Like Carbon, Heat Dissipation, Sputter.


Author - Chi-Wen Liu, Po-Chuan Pan, Chii-Ruey Lin, Yin-Tung Albert Sun

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| Published on 2019-11-18
   
   
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